Born2Bond Products
Hot Melt Polyurethane Reactive
HMPUR solutions span a range of viscosities, providing flexibility in the choice of processing method:
Low viscosity products can be swirl-sprayed
High viscosity products allow for bead applications
All are suitable for roll coating
Some products can be applied by all 3 methods
HMPUR Features
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High bio-based content
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Moisture curable
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High initial strength & fast curing
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Adheres to variety of material substances
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High final bonding strength & excellent aging performance
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Lower dispensing temperature (90'C to 120'C) & excellent jetting performance
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100% solids & therefore have no volatile organic compounds (VOCs)
HMPUR Benefits
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Moisture curing
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Adhere to variety of substrates
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​Good balance between strength & elasticity
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Accommodates bonding of dissimilar substrates
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Low application temperature (110'C to 130'C)
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Good temperature, humidity and chemical resistance
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One-component solution for a simplified buying process
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Ability to provide "green strength" upon cooling prior to cure
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Sustainable & environmentally friendly
HMPUR Applications
Earphone
Electronic Speaker
Smart Glass
Notebook LCD
Smart Watch
Smart Phone
Smart Pad
Car Infotainment
UV-Cure in Place Gasket (UV-CIPG)
Born2BondTM UV-Cure in Place Gasket (UV-CIPG) adhesive solution is a gasket system commonly used in applications that require a fast, cost-effective and revolutionary solution, especially in the electronics manufacturing and automotive sectors and general applications.
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Born2BondTM UV-Cure in Place Gasket (UV-CIPG) is Bostik latest innovation to address modern industry demands.
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Born2BondTM UV-Cure can be simply cured using UV rays during the application of the adhesive.
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Born2BondTM UV-Cure in Place Gasket (UV-CIPG) method can be easily applied with an automated dispenser which could be programmed to follow specific application areas.
UV-Cure in Place Gasket (UV-CIPG) Features
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UV instant Cure
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Waterproof / Dustproof (IPX7 obtained)
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High adhesion to metal & plastics
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Having lower surface tackiness
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Precise automated dispensing
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Low compression set
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Excellent chemical, hydrolysis & chemical resistance
UV-Cure in Place Gasket (UV-CIPG) Benefits
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Full automataion (Reduce labor)
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Less wastage
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Proven durability to electronic devices
UV-Cure In Place Gasket (UV-CIPG) Applications
Security Camera
Wearable Devices
Tablet PC
Digital Camera
ADAS
Car Infotainment
Battery Pack
Engine Control Unit
Cyanoacrylate Technologies
To date, instant engineering adhesive performance and applications have been constrained by the limitation of existing cyanoacrylate technologies.
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Through a unique process, Bostik has unlocked the potential of these technologies and develop a range of instant adhesives to deliver the high-performance, user-friendly properties that engineers uses.
Low Odor
Low Bloom
High Performance
THERMELT Low Pressure Molding
The Thermelt Low Pressure Molding is used to encapsulate electronic components. Low Pressure Molding (LPM) serves an important role in protecting and sealing items against moisture, dust, dirt and debris. Simplified to a single , fast process, LPM is a cross between classic plastic injection and resin potting. It is ideal for connectors, onboard electronics, LEDs and PCBs (Printed Circuit Boards).
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Thermally conductive polyamide enables low-pressure molding technology to be used in demanding applications that require higher thermal conductivity, such as automotive and other electronics components.
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Bostik provides thermal conductivity products from 1.0 to 2.0 W/mk.
Bostik has developed partnerships with equipment manufacturer and low-pressure injection experts, in addition to our technical know-how of the LPM process, enabling the company to offer the best solution for every encapsulation project.
Bostik’s LPM solutions include Thermelt, a comprehensive range of hot melt polyamide adhesives designed to meet customers' unique needs. Multipurpose with high resistance to temperature and oil, these adhesives offer easy process at low pressure and low temperatures, which enables them to encapsulate even fragile, sensitive electronics for the most demanding environments.
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Bostik also manufactures reactive polyamides (PAR) that can withstand temperatures up to 200°C. Other formulations offer more cohesion and higher thermal stability for certain applications.
THERMELT Low Pressure Molding Applications
Captors & Sensors
Antennas
PCB Molding
Cables & Connectors
Water-Based Adhesive (WBA) Solutions
Industrial adhesive serve various industries spanning from packaging to leather goods to automotive. Whilst there are multiple adhesive options for a variety of applications, water-based adhesives are a environmentally friendly alternative for companies looking to create a better and safer work environments.
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Committed to both environmental responsibility and the well-being of our customers, Medi Klebstoff is proud to utilize Bostik's environmentally friendly, water-based construction adhesive solutions. This choice reflects our dedication to providing quality products with low odor and minimal Volatile Organic Compounds (VOC), ensuring a positive and sustainable experience for our valued customers.
Benefits of Water-Based Adhesive Solutions
Solvent-free adhesive solutions - Safe to use
Low-temperature applications to reduce energy consumption
High heat resistance
Compatible with recyclable substrate
Low VOC content
Easy clean up
No odor
Versatile
Water-Based Adhesive (WBA) Applications
Smart speaker nylon fabric & PC/ABS shell bonding. Thickness of dry adhesive ~40–100µm
Glasses case PU foam with nylon flocking fibre. Thickness of dry adhesive ~50–100µm
Facial interface bracket - Lamination. PU foam with fabric or leather